PBPE-06V464

Intel® Xeon® D-1700 Processor based Type 7 COM Express® Basic Module with 16x PCIe Gen 4 and 16x PCIe Gen 3 lanes, and 4x 10Gb Ethernet KR/KX4 interfaces

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LGA1700 Q670E Micro-ATX motherboard, LGA1700 Socket for 13th/12th Gen Intel CPU, 125W TDP, 4*U-DIMM, 3*Lan, 2*PCIe x16 slots, 4*DP, 2*M.2 slot, 10*COM, 7*SATA, USB 3.2 Gen 2, USB Type C

2U High Performance Platform with Intel® Dual 3rd Gen Xeon® Scalable CPU and up to Eight Network Modules

COM-HPC Evaluation Carrier Board for COM-HPC Client Type Module (305 x 244 mm)

SMARC Module with Intel® Elkhart Lake family processor

Arm System, NVIDIA Jetson, LPDDR4, eMMC, USB3, Dual LAN, HDMI, M.2 E, M.2 M, mini PCle, AEM, Dual SIM, 12-24V

1U Intel® Comet Lake Network Appliance with Up to 20 GbE Ports

COM-HPC Server type Carrier Board (305 x 330 mm)

Ultra-small form factor IPC designed as a compact industrial IoT gateway with multiple RS485 COM ports, USB ports, and M.2 and Mini-PCIe interfaces

2U High Performance Platform with Single Intel® 3rd Gen Xeon® Scalable CPU and Dual Network Modules

Compact size Rugged System with Intel® Elkhart Lake family processor
-100 x 100 x 40mm